News Releases

March 13, 2013

Industry Smallest Diodes (*1)
Contributes to Downsizing and Longer Battery Life for Smart Phones

“Smaller and High Power CSP Schottky Barrier Diode” for release

Perfect for power circuits in mobile applications

March 12, 2013, Osaka, Japan-Industrial Devices Company , Panasonic Corporation has launched a CSP type Schottky Barrier Diode with key characteristics such as Ultra Small Packaging, High Power and High Heat Dissipation, and Higher Efficiency with less Voltage Loss, suitable for Power Circuits in Mobile applications.

Related Information

Product

Schottky Barrier Diode

Series

DB2G series

DB2L series

DB2M series

VR/VF

20 to 40V/1A

12 to 30V/0.5A

12 to 20V/0.2A

Package size

1.0 x 0.6 x 0.1mm

0.6 x 0.3 x 0.1mm

0.4 x 0.2 x 0.1mm

MP schedule

Jun., 2013

Aug., 2013

Oct., 2013

Sample price

Please contact your local sales office

MP capacity

Over 3Mpcs/month

As Mobile applications, such as Smart Phones, continue to go smaller, thinner and lighter, board sizes also have the same size limitations, resulting in extremely dense circuit designs. Therefore, downsizing all components are a must and thermal management has become an even more important factor in board designs. Also, despite the limited space, the power supply circuit has even more loads with constantly growing data-communications and High-end High-tech functions. To solve these issues, Panasonic is announcing a new CSP Diode series, with features such as Ultra-small packaging. (0.6mm x 0.3mm), Industry top-level Low Forward Voltage (15% reduction), and Industry top-level thermal performance (33% heat reduction) . This series has a line-up of 16 parts to fit all customer designs and requirements.

Features

1. Achieved 0.5A(IF) with Industry Smallest Package size (*1)

<Package size>

SMT area

:

0.18mm2

86% reduction (*2)

Height

:

0.10mm

83% reduction (*2)

Volume

:

0.018mm3

98% reduction (*2)

<Rating>

IF

:

0.5A

2. Achieved Industry Top Level low VF (*3)

<VF characteristic>

:

0.39V(0.5A Typ)

15% reduction (*2)

3. Industry Top level Heat Dissipation characteristics (*3)

<Heat Dissipation>

Junction temp

:

80.9 ℃ 33% reduction (*2)

(conditions: 0.5A, outside temp 25 ℃)

*1 As a Schottky with Max current of 0.5A ( 1A, 0.2A part also industry smallest)、as of Mar., 12th, 2013
*2: In comparison to Panasonic DB2S20900L.
*3: For a 0603 size Schottky Barrier Diode, As of Mar., 12th, 2013

Applications

Power circuits for mobile applications such as Smart Phones, Tablets

The content in the following news releases is accurate at the time of publication but may be subject to change without notice.
Please note therefore that these documents may not always contain the most up-to-date information.