News Releases

May 28, 2013

Contributing to thinning IC substrates built in high performance mobile devices and to increasing the connection-reliability

Announcing the release of Halogen-free IC substrate materials, "MEGTRON GX series R-1515C"

Featuring the lowest coefficient of thermal expansion of 1ppm highest level in the industry (*1) and decreasing the warpage of thin IC substrates

(*1)Our investigation of IC substrate materials used for the IC substrates as of May 28, 2013.

May 28, 2013, Osaka Japan-Automotive & Industrial Systems Company, Panasonic Corporation has succeeded in commercializing halogen- free IC substrate materials, "MEGTRON GX series R-1515C", built in high performance mobile devices and contributing to decreasing the warpage of thin IC substrates.

Related Information

Product Name

Halogen-free IC substrate materials

Series name

MEGTRON GX series

Part number

Core materials: R-1515C
Prepreg: R-1410C

Sample production

May 2013

Production start

Autumn 2013

Price

To be confirmed individually (depending on quantities)

As high performance mobile devices, such as smart phones, have become to be thinner as well as more multi-functional, IC substrate materials to be built in have been required to be decreasing the warpage of thin IC substrates and to be increasing the connection-reliability between the motherboard. To meet the market demand, Automotive & Industrial Systems Company, Panasonic corporation has succeeded in developing halogen-free IC substrate materials "MEGTRON GX series", realizing the lowest coefficient of thermal expansion of 1ppm highest level in the industry (*1).

Features

1. The lowest coefficient of thermal expansion in the industry (*1), contributing to thinning the IC substrates due to the small warpage of the substrates and the high connection-reliability

The lowest coefficient of thermal expansion of 1ppm (*2) in the industry (*1)(our current models: 3ppm)
The warpage of the IC substrates: approx. 30% decreasing (*4) compared with our current models (*3)

2.Available for the same resin prepreg as core materials

3.Halogen-free, equivalent to UL Frame-retardant 94V-0

(*2) Coefficient of thermal expansion in the surface direction of the materials
(*3) Our current models: IC substrate materials "MEGTRON GX series" (part number: R-1515KH)
(*4) Our actually measured value: ICs are mounted on the double-sided board of the package size (L 13 mm, W 13 mm, T 0.1 mm), shielded, and then after thermal shock testing [25°C(room temperature) -> 260°C25°C(room temperature)], the warpage is measured based on Shadow Moire measurement.

Notes

We will exhibit the newly developed materials at JPCA Show held in Tokyo Big Site (from June 5 to 7, 2013)

Applications

Thin IC substrates built in smart phones and tablet PCs, etc.

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Please note therefore that these documents may not always contain the most up-to-date information.