News Releases

Apr 21, 2014

To "the development and commercialization of Multi-layer Circuit Board Materials adaptable to high-speed transmission", the Ichimura Industrial Prize / Achievement Award was awarded

April 21, 2014, Osaka, Japan - Automotive & Industrial Systems Company, Panasonic Corporation won the Achievement Award of the 46th Ichimura Industrial Prize from New Technology Development Foundation (Public benefit corporation) to “ the achievement of development and commercialization of Multi-layer Circuit Board Materials adaptable to high-speed transmission ”, and presentation ceremony was held on April 18.

Awarding contents

Name:

Ichimura Industrial Prize / Achievement Award

Theme:

“The development and commercialization of
Multi-layer Circuit Board Materials adaptable to high-speed transmission”

Winner:

Panasonic Corporation
Automotive & Industrial Systems Company, Electronic Material Business Division
Hiroharu Inoue (Technology Development Center)
Kiyotaka Komori (Circuit Board Materials Division)
Hiroaki Fujiwara (Technology Development Center)

Development contents

In recent years, with the increasing popularity of information terminals, such as smart phones and tablet PCs, as well as SNS or video sites, the needs for processing more quickly a large amount of data have been required increasingly. The development of routers and servers with high-performance properties have been greatly progressing. In the Circuit Board Materials responsible for the center of the devices, we have succeeded in developing the multi-layer Circuit Board materials adaptable to large capacity, high-speed transmission and high layer count. Newly developed materials have contributed to putting into practical use of the large-scale ultra-high-speed server to process the data at a high-speed and to improving the performance of supercomputers.

Features and Effect of developed technology

This technology made it possible to reduce the transmission loss by 50% or more compared with current materials and to produce the high layer count Circuit Boards with more than 60 layers structure by having the high heat-resistance properties adaptable to a lead-free soldering. The Circuit Board using this technology realized the large-scale ultra-high-speed servers to process the Internet data increased explosively at a high-speed, and has contributed to ensuring the installation space and to finding a final solution to the increasing power consumption (has been facing in many data centers), and also to reducing the environmental impact significantly. Further more, this technology has contributed to improving the performance of super computers and the further contribution has been expected to support the development in the wider range of applications, including medical care and energy.

Panasonic activities

Automotive & Industrial Systems Company, Panasonic Corporation had started to produce and sell the Multi-layer Circuit Board Materials adaptable to high-speed transmission as a “MEGTRON series” in 1996. Adding to this MEGTRON series, we have developed the new line-up of MEGTRON6, MEGTRON4, Halogen-free MEGTRON2 with different properties including dielectric constant, dielectric loss tangent, heat resistance. In future, we will continue to develop the next-generation materials with advanced dielectric-properties, and to boost-up sales globally.

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